IC FLASH 32MBIT SPI/QUAD 8SOP
| Part | Write Cycle Time - Word, Page [custom] | Write Cycle Time - Word, Page [custom] | Memory Type | Mounting Type | Memory Format | Technology | Access Time | Voltage - Supply [Max] | Voltage - Supply [Min] | Supplier Device Package | Operating Temperature [Max] | Operating Temperature [Min] | Memory Size | Memory Organization | Clock Frequency | Memory Interface | Package / Case [y] | Package / Case | Package / Case [x] | Write Cycle Time - Word, Page |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GigaDevice Semiconductor (HK) Limited | 60 µs | 2.4 ms | Non-Volatile | Surface Mount | FLASH | FLASH - NOR (SLC) | 6 ns | 2 V | 1.65 V | 8-SOP | 85 °C | -40 °C | 32 Gbit | 4M x 8 | 133 MHz | QPI Quad I/O SPI | 5.3 mm | 8-SOIC | 0.209 " | |
GigaDevice Semiconductor (HK) Limited | 60 µs | 2.4 ms | Non-Volatile | Surface Mount | FLASH | FLASH - NOR (SLC) | 6 ns | 2 V | 1.65 V | 10-WLCSP | 85 °C | -40 °C | 32 Gbit | 4M x 8 | 133 MHz | QPI Quad I/O SPI | 10-XFBGA WLCSP | |||
GigaDevice Semiconductor (HK) Limited | 60 µs | 2.4 ms | Non-Volatile | Surface Mount | FLASH | FLASH - NOR (SLC) | 6 ns | 2 V | 1.65 V | 8-USON (3x4) | 85 °C | -40 °C | 32 Gbit | 4M x 8 | 133 MHz | QPI Quad I/O SPI | 8-UDFN Exposed Pad | |||
GigaDevice Semiconductor (HK) Limited | 100 µs | 4 ms | Non-Volatile | Surface Mount | FLASH | FLASH - NOR (SLC) | 6 ns | 2 V | 1.65 V | 8-USON (3x2) | 125 °C | -40 °C | 32 Gbit | 4M x 8 | 133 MHz | QPI Quad I/O SPI | 8-XFDFN Exposed Pad | |||
GigaDevice Semiconductor (HK) Limited | Non-Volatile | Surface Mount | FLASH | FLASH - NOR | 2 V | 1.65 V | 85 °C | -40 °C | 32 Gbit | 4M x 8 | 120 MHz | SPI - Quad I/O | 21-XFBGA WLSCP | 2.4 ms | ||||||
GigaDevice Semiconductor (HK) Limited | 60 µs | 2.4 ms | Non-Volatile | Surface Mount | FLASH | FLASH - NOR (SLC) | 6 ns | 2 V | 1.65 V | 8-USON (4x4) | 85 °C | -40 °C | 32 Gbit | 4M x 8 | 133 MHz | QPI Quad I/O SPI | 8-XDFN Exposed Pad |