L17HTHAP4 Series

Manufacturer: Amphenol ICC (Commercial Products)

Catalog

CONN D-SUB HD PLUG 26P R/A SLDR

Part	Number of Rows	Current Rating (Amps)	Mounting Type	Contact Finish	Termination	Dielectric Material	Contact Finish Thickness	Contact Finish Thickness	Flange Feature	Contact Form	Material Flammability Rating	Features	Connector Style	Number of Positions	Contact Material	Shell Size, Connector Layout	Shell Size, Connector Layout	Contact Type	Backset Spacing	Backset Spacing	Voltage Rating	Connector Type	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish Thickness
Amphenol ICC (Commercial Products) L17HTHAP4R2C	3	3 A	Through Hole Right Angle	Gold	Solder	Thermoplastic Glass Filled	15 µin	0.38 µm	4-40 Board Side	Stamped	UL94 V-0	Board Lock Grounding Indents	D-Sub High Density	26	Copper Alloy	2	(DA A) High Density	Signal	8.89 mm	0.35 in	300 VDC	Male Pins Plug	-55 °C	150 °C
Amphenol ICC (Commercial Products) L17HTHAP4R4C	3	3 A	Through Hole Right Angle	Gold	Solder	Thermoplastic Glass Filled	30 Áin	0.76 Ám	4-40 Board Side	Stamped	UL94 V-0	Board Lock Grounding Indents	D-Sub High Density	26	Copper Alloy	2	(DA A) High Density	Signal	8.89 mm	0.35 in	300 VDC	Male Pins Plug	-55 °C	150 °C
Amphenol ICC (Commercial Products) L17HTHAP4F4C	3	3 A	Through Hole Right Angle	Gold	Solder	Thermoplastic Glass Filled	30 Áin	0.76 Ám	Female Screwlock (4-40) Mating Side	Stamped	UL94 V-0	Board Lock Grounding Indents	D-Sub High Density	26	Copper Alloy	2	(DA A) High Density	Signal	8.89 mm	0.35 in	300 VDC	Male Pins Plug	-55 °C	150 °C
Amphenol ICC (Commercial Products) L17HTHAP4F1C	3	3 A	Through Hole Right Angle	Gold	Solder	Thermoplastic Glass Filled			Female Screwlock (4-40) Mating Side	Stamped	UL94 V-0	Board Lock Grounding Indents	D-Sub High Density	26	Copper Alloy	2	(DA A) High Density	Signal	8.89 mm	0.35 in	300 VDC	Male Pins Plug	-55 °C	150 °C	Flash