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CONN IC DIP SOCKET ZIF 48POS
| Part | Housing Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Pitch - Mating | Pitch - Mating | Current Rating (Amps) | Contact Material - Mating | Contact Finish - Mating | Features | Type | Type | Type | Number of Positions or Pins (Grid) | Pitch - Post | Pitch - Post | Contact Finish - Post | Termination Post Length | Termination Post Length | Contact Material - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Mounting Type | Termination | Operating Temperature [Min] | Operating Temperature [Max] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Polyphenylene Sulfide (PPS) Glass Filled | 1.27 µm | 50 µin | UL94 V-0 | 0.1 in | 2.54 mm | 1 A | Beryllium Copper | Nickel Boron | Closed Frame | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | 48 | 2.54 mm | 0.1 in | Nickel Boron | 0.11 in | 2.78 mm | Beryllium Copper | 1.27 µm | 50 µin | Through Hole | Solder | ||
Aries Electronics | Polyetheretherketone (PEEK) Glass Filled | 1.27 µm | 50 µin | UL94 V-0 | 0.1 in | 2.54 mm | 1 A | Beryllium Nickel | Nickel Boron | Closed Frame | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | 48 | 2.54 mm | 0.1 in | Nickel Boron | 0.11 in | 2.78 mm | Beryllium Nickel | 1.27 µm | 50 µin | Through Hole | Solder | -55 °C | 250 °C |