BOARD-TO-BOARD CONNECTOR, LOW PROFILE, BBL SERIES, THROUGH HOLE, HEADER, 32, 2.54 MM ROHS COMPLIANT: YES
| Part | Overall Contact Length | Overall Contact Length | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Connector Type | Termination | Fastening Type | Contact Length - Mating [x] | Contact Length - Mating [x] | Number of Rows | Insulation Color | Pitch - Mating | Pitch - Mating | Contact Shape | Contact Type | Contact Length - Post [x] | Contact Length - Post [x] | Insulation Height | Insulation Height | Number of Positions Loaded | Insulation Material | Shrouding | Contact Finish - Post | Operating Temperature [Min] | Operating Temperature [Max] | Mounting Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Mating | Overall Contact Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 8.43 mm | 0.332 in | 1.27 µm | 50 µin | Header | Solder | Push-Pull | 0.122 in | 3.1 mm | 1 | Black | 0.1 in | 2.54 mm | Circular | Male Pin | 3.18 mm | 0.125 in | 0.085 " | 2.15 mm | All | Liquid Crystal Polymer (LCP) | Unshrouded | Nickel | -55 °C | 125 °C | Through Hole | 0.51 µm | 20 µin | Gold | |
Samtec Inc. | 8.43 mm | 0.332 in | 1.27 µm | 50 µin | Header | Solder | Push-Pull | 0.122 in | 3.1 mm | 1 | Black | 0.1 in | 2.54 mm | Circular | Male Pin | 3.18 mm | 0.125 in | 0.085 " | 2.15 mm | All | Liquid Crystal Polymer (LCP) | Unshrouded | Nickel | -55 °C | 125 °C | Through Hole | ||||
Samtec Inc. | 7.62 mm | 1.27 µm | 50 µin | Header | Solder | Push-Pull | 1 | Black | 0.1 in | 2.54 mm | Circular | Male Pin | 3.18 mm | 0.125 in | 0.07 in | 1.78 mm | All | Liquid Crystal Polymer (LCP) | Unshrouded | Nickel | -55 °C | 125 °C | Through Hole | 0.3 in |