Beta
⌘K
NP560 SN96.5AG3.0CU0.5 T4 500 G
| Part | Form | Form | Flux Type | Shelf Life | Shelf Life Start | Type | Storage/Refrigeration Temperature [Min] | Storage/Refrigeration Temperature [Max] | Storage/Refrigeration Temperature [Max] | Storage/Refrigeration Temperature [Min] | Shipping Info | Mesh Type [custom] | Melting Point [Min] | Melting Point [Min] | Melting Point [Max] | Melting Point [Max] | Composition | Form |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Kester Solder | Jar | 17.64 oz 500 g | No-Clean | 12 Months | Date of Manufacture | Solder Paste | 0 °C | 50 °F | 10 °C | 0 °C | Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended. | 4 | 217 °C | 423 °F | 218 °C | 424 °F | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | |
Kester Solder | Cartridge | 600 g | No-Clean | 12 Months | Date of Manufacture | Solder Paste | 0 °C | 50 °F | 10 °C | 0 °C | Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended. | 4 | 217 °C | 423 °F | 218 °C | 424 °F | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 21.16 oz |