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CONN IC DIP SOCKET 6POS GOLD
| Part | Material Flammability Rating | Termination | Current Rating (Amps) | Contact Material - Mating | Pitch - Mating | Pitch - Mating | Contact Material - Post [custom] | Contact Finish - Post | Type | Type | Type | Mounting Type | Housing Material | Features | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Mating | Termination Post Length | Termination Post Length | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | UL94 V-0 | Solder | 3 A | Beryllium Copper | 0.1 in | 2.54 mm | Brass | Tin | 0.3 " | 7.62 mm | DIP | Surface Mount | Glass Filled Nylon 4/6 Polyamide (PA46) | Open Frame | 200 µin | 5.08 µm | 10 çin | 0.25 çm | Gold | 3.18 mm | 0.125 in | 2.54 mm | 0.1 in | 2 | 6 | 3 |
Aries Electronics | UL94 V-0 | Solder | 3 A | Beryllium Copper | 0.1 in | 2.54 mm | Brass | Gold | 0.3 " | 7.62 mm | DIP | Through Hole | Glass Filled Nylon 4/6 Polyamide (PA46) | Open Frame | 10 çin | 0.25 çm | 10 çin | 0.25 çm | Gold | 3.18 mm | 0.125 in | 2.54 mm | 0.1 in | 2 | 6 | 3 |
Aries Electronics | UL94 V-0 | Solder | 3 A | Beryllium Copper | 0.1 in | 2.54 mm | Brass | Gold | 0.3 " | 7.62 mm | DIP | Through Hole | Glass Filled Nylon 4/6 Polyamide (PA46) | Open Frame | 10 çin | 0.25 çm | 10 çin | 0.25 çm | Gold | 3.18 mm | 0.125 in | 2.54 mm | 0.1 in | 2 | 6 | 3 |