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CONN IC DIP SOCKET ZIF 48POS TIN
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Type | Type | Type | Features | Termination Post Length | Termination Post Length | Termination | Mounting Type | Contact Material - Mating | Pitch - Post | Pitch - Post | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Material Flammability Rating | Contact Material - Post | Current Rating (Amps) | Number of Positions or Pins (Grid) | Housing Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 5.08 µm | 200 µin | Tin | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Closed Frame | 0.11 in | 2.78 mm | Solder | Through Hole | Beryllium Copper | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | UL94 V-0 | Beryllium Copper | 1 A | 48 | Polyphenylene Sulfide (PPS) Glass Filled |