PGA GOLD BERYLLIUM COPPER ALLOY -65℃~+125℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS
| Part | Current Rating (Amps) | Pitch - Mating | Pitch - Mating | Mounting Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Mating | Operating Temperature [Max] | Operating Temperature [Min] | Pitch - Post | Pitch - Post | Contact Material - Mating | Contact Material - Post | Features | Material Flammability Rating | Termination Post Length | Termination Post Length | Termination |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 1 A | 0.1 in | 2.54 mm | Through Hole | 30 Áin | 0.76 Ám | Tin | PGA ZIF (ZIP) | 200 µin | 5.08 µm | Gold | 125 °C | -65 ░C | 2.54 mm | 0.1 in | Beryllium Copper | Beryllium Copper | Closed Frame | UL94 V-0 | 3.18 mm | 0.125 in | Solder |