32-3551 Series

Catalog

CONN IC DIP SOCKET ZIF 32POS

Part	Termination	Contact Finish - Post	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Features	Contact Material - Post	Mounting Type	Current Rating (Amps)	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Material Flammability Rating	Termination Post Length	Termination Post Length	Contact Material - Mating	Contact Finish - Mating	Type	Type	Type	Housing Material	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 32-3551-16	Solder	Nickel Boron	2.54 mm	0.1 in	1.27 µm	50 µin	2 x 16	32	Closed Frame	Beryllium Copper	Through Hole	1 A	0.1 in	2.54 mm	1.27 µm	50 µin	UL94 V-0	0.11 in	2.78 mm	Beryllium Copper	Nickel Boron	7.62 mm	0.3 in	DIP ZIF (ZIP)	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 32-3551-10	Solder	Tin	2.54 mm	0.1 in	5.08 µm	200 µin	2 x 16	32	Closed Frame	Beryllium Copper	Through Hole	1 A	0.1 in	2.54 mm	5.08 µm	200 µin	UL94 V-0	0.11 in	2.78 mm	Beryllium Copper		7.62 mm	0.3 in	DIP ZIF (ZIP)	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 32-3551-11	Solder	Gold	2.54 mm	0.1 in			2 x 16	32	Closed Frame	Beryllium Copper	Through Hole	1 A	0.1 in	2.54 mm			UL94 V-0	0.11 in	2.78 mm	Beryllium Copper	Gold	7.62 mm	0.3 in	DIP ZIF (ZIP)	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 32-3551-18	Solder	Nickel Boron	2.54 mm	0.1 in	1.27 µm	50 µin	2 x 16	32	Closed Frame	Beryllium Nickel	Through Hole	1 A	0.1 in	2.54 mm	1.27 µm	50 µin	UL94 V-0	0.11 in	2.78 mm	Beryllium Nickel	Nickel Boron	7.62 mm	0.3 in	DIP ZIF (ZIP)	Polyetheretherketone (PEEK) Glass Filled	-55 °C	250 °C