CONN SOCKET PGA 400POS GOLD
| Part | Operating Temperature [Min] | Operating Temperature [Max] | Features | Termination | Current Rating (Amps) | Number of Positions or Pins (Grid) | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Contact Finish Thickness - Mating | Housing Material | Contact Resistance | Pitch - Post | Pitch - Post | Contact Finish Thickness - Post | Material Flammability Rating | Contact Material - Post [custom] | Contact Material - Mating | Mounting Type | Contact Finish - Mating | Termination Post Length | Termination Post Length | Type | Number of Positions or Pins (Grid) [x] | Number of Positions or Pins (Grid) [y] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
PRECI-DIP SA | -55 °C | 125 °C | Closed Frame | Solder | 1 A | 400 | 0.05 in | 1.27 mm | Gold | Flash | FR4 Epoxy Glass | 10 mOhm | 1.27 mm | 0.05 in | Flash | UL94 V-0 | Brass | Beryllium Copper | Through Hole | Gold | 0.11 in | 2.78 mm | PGA | ||
PRECI-DIP SA | -55 °C | 125 °C | Open Frame | Solder | 1 A | 357 | 0.05 in | 1.27 mm | Gold | Flash | FR4 Epoxy Glass | 10 mOhm | 1.27 mm | 0.05 in | Flash | UL94 V-0 | Brass | Beryllium Copper | Through Hole | Gold | 0.11 in | 2.78 mm | PGA | ||
PRECI-DIP SA | -55 °C | 125 °C | Closed Frame | Solder | 1 A | 400 | 0.05 in | 1.27 mm | Gold | Flash | FR4 Epoxy Glass | 10 mOhm | 1.27 mm | 0.05 in | Flash | UL94 V-0 | Brass | Beryllium Copper | Surface Mount | Gold | 0.062 " 1.57 mm | PGA | |||
PRECI-DIP SA | -55 °C | 125 °C | Open Frame | Solder | 1 A | 520 | 0.05 in | 1.27 mm | Gold | Flash | FR4 Epoxy Glass | 10 mOhm | 1.27 mm | 0.05 in | Flash | UL94 V-0 | Brass | Beryllium Copper | Through Hole | Gold | 0.11 in | 2.78 mm | PGA | ||
PRECI-DIP SA | -55 °C | 125 °C | Open Frame | Solder | 1 A | 652 | 0.05 in | 1.27 mm | Gold | Flash | FR4 Epoxy Glass | 10 mOhm | 1.27 mm | 0.05 in | Flash | UL94 V-0 | Brass | Beryllium Copper | Surface Mount | Gold | 0.062 " 1.57 mm | PGA | |||
PRECI-DIP SA | -55 °C | 125 °C | Open Frame | Solder | 1 A | 255 | 0.05 in | 1.27 mm | Gold | Flash | FR4 Epoxy Glass | 10 mOhm | 1.27 mm | 0.05 in | Flash | UL94 V-0 | Brass | Beryllium Copper | Surface Mount | Gold | 0.062 " 1.57 mm | PGA | |||
PRECI-DIP SA | -55 °C | 125 °C | Open Frame | Solder | 1 A | 480 | 0.05 in | 1.27 mm | Gold | Flash | FR4 Epoxy Glass | 10 mOhm | 1.27 mm | 0.05 in | Flash | UL94 V-0 | Brass | Beryllium Copper | Through Hole | Gold | 0.11 in | 2.78 mm | PGA | ||
PRECI-DIP SA | -55 °C | 125 °C | Open Frame | Solder | 1 A | 560 | 0.05 in | 1.27 mm | Gold | Flash | FR4 Epoxy Glass | 10 mOhm | 1.27 mm | 0.05 in | Flash | UL94 V-0 | Brass | Beryllium Copper | Surface Mount | Gold | 0.062 " 1.57 mm | PGA | 33 | 33 | |
PRECI-DIP SA | -55 °C | 125 °C | Open Frame | Solder | 1 A | 456 | 0.05 in | 1.27 mm | Gold | Flash | FR4 Epoxy Glass | 10 mOhm | 1.27 mm | 0.05 in | Flash | UL94 V-0 | Brass | Beryllium Copper | Through Hole | Gold | 0.11 in | 2.78 mm | PGA | ||
PRECI-DIP SA | -55 °C | 125 °C | Open Frame | Solder | 1 A | 192 | 0.05 in | 1.27 mm | Gold | Flash | FR4 Epoxy Glass | 10 mOhm | 1.27 mm | 0.05 in | Flash | UL94 V-0 | Brass | Beryllium Copper | Through Hole | Gold | 0.11 in | 2.78 mm | PGA |