HEATSINK CPU W/ADHESIVE 1.11"SQ
| Part | Package Cooled | Type | Thermal Resistance @ Forced Air Flow | Attachment Method | Material | Shelf Life | Shape | Fin Height | Fin Height | Length [x] | Length [x] | Material Finish | Width [x] | Width [x] | Thermal Resistance @ Natural |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Tusonix a Subsidiary of CTS Electronic Components | ASIC BGA CPU LGA | Top Mount | 7.2 °C/W 400 LFM | Thermal Tape Adhesive (Included) | Aluminum | 24 Months | Pin Fins Square | 9.02 mm | 0.355 in | 1.11 in | 28.19 mm | Black Anodized | 1.11 in | 28.19 mm | 20.9 °C/W |