50-9503 Series

Catalog

CONN IC DIP SOCKET 50POS GOLD

Part	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Type	Type	Contact Finish - Post	Contact Finish - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Mounting Type	Material Flammability Rating	Housing Material	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Termination	Termination Post Length	Termination Post Length	Pitch - Post	Pitch - Post	Contact Material - Post	Current Rating (Amps)	Pitch - Mating	Pitch - Mating	Termination Post Length [x]	Termination Post Length [x]
Aries Electronics 50-9503-31	Beryllium Copper	10 çin	0.25 çm	22.86 mm	DIP	0.9 in	Gold	Gold	-55 °C	125 °C	Closed Frame	10 çin	0.25 çm	Through Hole	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)	25	2	50	Wire Wrap	0.5 in	12.7 mm	2.54 mm	0.1 in	Phosphor Bronze	3 A	0.1 in	2.54 mm
Aries Electronics 50-9503-21	Beryllium Copper	10 çin	0.25 çm	22.86 mm	DIP	0.9 in	Gold	Gold	-55 °C	125 °C	Closed Frame	10 çin	0.25 çm	Through Hole	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)	25	2	50	Wire Wrap			2.54 mm	0.1 in	Phosphor Bronze	3 A	0.1 in	2.54 mm	0.36 in	9.14 mm
Aries Electronics 50-9503-30	Beryllium Copper	200 µin	5.08 µm	22.86 mm	DIP	0.9 in	Tin	Gold	-55 °C	105 ░C	Closed Frame	10 çin	0.25 çm	Through Hole	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)	25	2	50	Wire Wrap	0.5 in	12.7 mm	2.54 mm	0.1 in	Phosphor Bronze	3 A	0.1 in	2.54 mm