Beta
⌘K
CONN PCI EXP FMALE 230POS 0.039
| Part | Color | Material - Insulation | Card Type | Pitch [x] | Pitch [x] | Termination | Mounting Type | Contact Finish | Card Thickness | Card Thickness | Gender | Read Out | Number of Positions | Features | Contact Finish Thickness | Contact Finish Thickness | Contact Material | Number of Rows | Contact Type | Number of Positions/Bay/Row [custom] | Number of Positions/Bay/Row [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Amphenol ICC (FCI) | Black | Thermoplastic Glass Filled | PCI Express™ | 0.039 in | 1 mm | Solder Staggered | Through Hole | Gold | 0.062 in | 1.57 mm | Female | Dual | 230 | Board Guide Locking Ramp | 0.76 Ám | 30 Áin | Copper Alloy | 2 | |||
Amphenol ICC (FCI) | Black | Thermoplastic Glass Filled | PCI Express™ | 0.039 in | 1 mm | Solder Staggered | Through Hole | Gold | 0.062 in | 1.57 mm | Female | Dual | 230 | Board Guide Locking Ramp | 0.38 µm | 15 µin | Copper Alloy | 2 | |||
Amphenol ICC (FCI) | Black | Thermoplastic Glass Filled | PCI Express™ | 0.039 in | 1 mm | Solder Staggered | Through Hole | Gold | 0.062 in | 1.57 mm | Female | Dual | 230 | Board Guide Locking Ramp | 0.76 Ám | 30 Áin | Copper Alloy | 2 | |||
Amphenol ICC (FCI) | Black | Thermoplastic Glass Filled | PCI Express™ | 0.079 in | 2 mm | Solder | Through Hole | Gold | 0.062 in | 1.57 mm | Female | Dual | 230 | Board Guide Locking Ramp | 0.38 µm | 15 µin | Copper Alloy | 2 | Cantilever | 104 | 11 |