Beta
⌘K
CONN IC DIP SOCKET ZIF 28POS
| Part | Contact Material - Post | Contact Finish - Mating | Number of Positions or Pins (Grid) | Housing Material | Pitch - Mating | Pitch - Mating | Features | Pitch - Post | Pitch - Post | Termination Post Length | Termination Post Length | Contact Finish - Post | Type | Type | Type | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Current Rating (Amps) | Mounting Type | Termination | Contact Material - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Beryllium Copper | Nickel Boron | 28 | Polyphenylene Sulfide (PPS) Glass Filled | 0.1 in | 2.54 mm | Closed Frame | 2.54 mm | 0.1 in | 0.11 in | 2.78 mm | Nickel Boron | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | UL94 V-0 | 1.27 µm | 50 µin | 1 A | Through Hole | Solder | Beryllium Copper | 1.27 µm | 50 µin |
Aries Electronics | Beryllium Copper | 28 | Polyphenylene Sulfide (PPS) Glass Filled | 0.1 in | 2.54 mm | Closed Frame | 2.54 mm | 0.1 in | 0.11 in | 2.78 mm | Tin | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | UL94 V-0 | 5.08 µm | 200 µin | 1 A | Through Hole | Solder | Beryllium Copper | 5.08 µm | 200 µin |