HEATSINK FORGED BLK ANO TOP MNT
| Part | Thermal Resistance @ Forced Air Flow | Width [y] | Width [y] | Length | Length | Package Cooled | Thermal Resistance @ Natural | Material | Attachment Method | Shape | Shelf Life | Type | Material Finish | Fin Height | Fin Height | Fin Height [z] | Fin Height [z] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Tusonix a Subsidiary of CTS Electronic Components | 5.62 °C/W | 20.6 mm | 0.811 in | 0.811 in | 20.6 mm | ASIC BGA CPU LGA | 15.1 °C/W | Aluminum Alloy | Thermal Tape Adhesive (Included) | Fins Square | 24 Months | Top Mount | Black Anodized | ||||
Tusonix a Subsidiary of CTS Electronic Components | 3.42 °C/W 200 LFM | 20.6 mm | 0.811 in | 0.811 in | 20.6 mm | ASIC BGA CPU LGA | 12.2 °C/W | Aluminum Alloy | Thermal Tape Adhesive (Included) | Fins Square | 24 Months | Top Mount | Black Anodized | 22.61 mm | 0.89 in | ||
Tusonix a Subsidiary of CTS Electronic Components | 4.42 °C/W 200 LFM | 20.6 mm | 0.811 in | 0.811 in | 20.6 mm | ASIC BGA CPU LGA | Aluminum Alloy | Thermal Tape Adhesive (Included) | Fins Square | 24 Months | Top Mount | Black Anodized | 20.6 mm | 0.811 in | |||
Tusonix a Subsidiary of CTS Electronic Components | 4.82 °C/W 200 LFM | 20.6 mm | 0.811 in | 0.811 in | 20.6 mm | ASIC BGA CPU LGA | 14.3 °C/W | Aluminum Alloy | Thermal Tape Adhesive (Included) | Fins Square | 24 Months | Top Mount | Black Anodized | ||||
Tusonix a Subsidiary of CTS Electronic Components | 3.72 °C/W 200 LFM | 20.6 mm | 0.811 in | 0.811 in | 20.6 mm | ASIC BGA CPU LGA | 13.5 °C/W | Aluminum Alloy | Thermal Tape Adhesive (Included) | Fins Square | 24 Months | Top Mount | Black Anodized | 27.6 mm | 1.087 in | ||
Tusonix a Subsidiary of CTS Electronic Components | 3.42 °C/W 200 LFM | 20.6 mm | 0.811 in | 0.811 in | 20.6 mm | ASIC BGA CPU LGA | 12.2 °C/W | Aluminum Alloy | Thermal Tape Adhesive (Included) | Fins Square | 24 Months | Top Mount | Black Anodized | 32.6 mm | 1.283 " |