SMT CONTACT PAD, 3.2X0.20MM, CIRCULAR
| Part | Operating Temperature [Max] | Operating Temperature [Min] | Pad Layout Dimension [z] | Pad Layout Dimension [diameter] | Pad Layout Dimension [z] | Pad Layout Dimension [diameter] | Mounting Type | Contact Type | Contact Finish Thickness | Contact Finish | Contact Material | Current Rating (Amps) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
Harwin Inc. | 180 °C | -40 °C | 0.2 mm | 0.126 in | 0.008 in | 3.2 mm | Surface Mount | Contact Pad | Flash | Gold | Beryllium Copper | 6 A |