IC FLASH 128MBIT SPI 24TFBGA
| Part | Write Cycle Time - Word, Page [custom] | Write Cycle Time - Word, Page [custom] | Clock Frequency | Voltage - Supply [Min] | Voltage - Supply [Max] | Technology | Operating Temperature [Max] | Operating Temperature [Min] | Supplier Device Package | Memory Size | Memory Organization | Memory Type | Memory Format | Mounting Type | Memory Interface | Package / Case | Package / Case [y] | Package / Case [x] | Write Cycle Time - Word, Page | Access Time |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 3 ms | 50 µs | 104 MHz | 2.7 V | 3.6 V | FLASH - NOR | 85 °C | -40 °C | 24-TFBGA (6x8) | 128 Mb | 16M x 8 | Non-Volatile | FLASH | Surface Mount | QPI Quad I/O SPI | 24-TBGA | ||||
Winbond Electronics | 3 ms | 50 µs | 104 MHz | 2.7 V | 3.6 V | FLASH - NOR | 105 °C | -40 °C | 24-TFBGA (6x8) | 128 Mb | 16M x 8 | Non-Volatile | FLASH | Surface Mount | SPI - Quad I/O | 24-TBGA | ||||
Winbond Electronics | 3 ms | 50 µs | 104 MHz | 2.7 V | 3.6 V | FLASH - NOR | 105 °C | -40 °C | 8-WSON (8x6) | 128 Mb | 16M x 8 | Non-Volatile | FLASH | Surface Mount | SPI - Quad I/O | 8-WDFN Exposed Pad | ||||
Winbond Electronics | 5 ms | 60 µs | 104 MHz | 1.65 V | 1.95 V | FLASH - NOR | 85 °C | -40 °C | 8-SOIC | 128 Mb | 16M x 8 | Non-Volatile | FLASH | Surface Mount | QPI Quad I/O SPI | 8-SOIC | 5.3 mm | 0.209 " | ||
Winbond Electronics | 3 ms | 50 µs | 104 MHz | 2.7 V | 3.6 V | FLASH - NOR | 85 °C | -40 °C | 16-SOIC | 128 Mb | 16M x 8 | Non-Volatile | FLASH | Surface Mount | QPI Quad I/O SPI | 16-SOIC | 7.5 mm | 0.295 in | ||
Winbond Electronics | 5 ms | 60 µs | 104 MHz | 1.65 V | 1.95 V | FLASH - NOR | 85 °C | -40 °C | 8-SOIC | 128 Mb | 16M x 8 | Non-Volatile | FLASH | Surface Mount | QPI Quad I/O SPI | 8-SOIC | 5.3 mm | 0.209 " | ||
Winbond Electronics | 133 MHz | 2.7 V | 3.6 V | FLASH - NOR | 105 °C | -40 °C | 8-WSON (8x6) | 128 Mb | 16M x 8 | Non-Volatile | FLASH | Surface Mount | DTR QPI Quad I/O SPI | 8-WDFN Exposed Pad | 3 ms | |||||
Winbond Electronics | 3 ms | 50 µs | 104 MHz | 2.7 V | 3.6 V | FLASH - NOR | 105 °C | -40 °C | 24-TFBGA (6x8) | 128 Mb | 16M x 8 | Non-Volatile | FLASH | Surface Mount | QPI Quad I/O SPI | 24-TBGA | ||||
Winbond Electronics | 133 MHz | 1.7 V | 1.95 V | FLASH - NOR | 105 °C | -40 °C | 8-SOIC | 128 Mb | 16M x 8 | Non-Volatile | FLASH | Surface Mount | SPI - Quad I/O | 8-SOIC | 5.3 mm | 0.209 " | 3 ms | 6 ns | ||
Winbond Electronics | 133 MHz | 1.7 V | 1.95 V | FLASH - NOR (SLC) | 85 °C | -40 °C | 16-SOIC | 128 Mb | 16M x 8 | Non-Volatile | FLASH | Surface Mount | SPI - Quad I/O | 16-SOIC | 7.5 mm | 0.295 in | 3 ms | 6 ns |