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CONN IC DIP SOCKET ZIF 48POS GLD
| Part | Contact Finish - Post | Material Flammability Rating | Number of Positions or Pins (Grid) | Type | Type | Type | Termination Post Length | Termination Post Length | Pitch - Post | Pitch - Post | Contact Material - Post | Current Rating (Amps) | Termination | Contact Finish - Mating | Features | Contact Material - Mating | Pitch - Mating | Pitch - Mating | Housing Material | Mounting Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Operating Temperature [Min] | Operating Temperature [Max] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Gold | UL94 V-0 | 48 | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | 0.11 in | 2.78 mm | 2.54 mm | 0.1 in | Beryllium Copper | 1 A | Solder | Gold | Closed Frame | Beryllium Copper | 0.1 in | 2.54 mm | Polyphenylene Sulfide (PPS) Glass Filled | Through Hole | ||||||
Aries Electronics | Tin | UL94 V-0 | 48 | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | 0.11 in | 2.78 mm | 2.54 mm | 0.1 in | Beryllium Copper | 1 A | Solder | Closed Frame | Beryllium Copper | 0.1 in | 2.54 mm | Polyphenylene Sulfide (PPS) Glass Filled | Through Hole | 200 µin | 5.08 µm | 5.08 µm | 200 µin | |||
Aries Electronics | Nickel Boron | UL94 V-0 | 48 | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | 0.11 in | 2.78 mm | 2.54 mm | 0.1 in | Beryllium Nickel | 1 A | Solder | Nickel Boron | Closed Frame | Beryllium Nickel | 0.1 in | 2.54 mm | Polyetheretherketone (PEEK) Glass Filled | Through Hole | 50 µin | 1.27 µm | 1.27 µm | 50 µin | -55 °C | 250 °C |