42-3573 Series

Catalog

CONN IC DIP SOCKET ZIF 42POS

Part	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Housing Material	Contact Material - Post	Termination Post Length	Termination Post Length	Termination	Type	Type	Type	Pitch - Mating	Pitch - Mating	Contact Material - Mating	Features	Mounting Type	Current Rating (Amps)	Pitch - Post	Pitch - Post	Material Flammability Rating	Contact Finish - Mating	Contact Finish - Post
Aries Electronics 42-3573-16	42	1.27 µm	50 µin	1.27 µm	50 µin	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Nickel	0.11 in	2.78 mm	Solder	7.62 mm	0.3 in	DIP ZIF (ZIP)	0.1 in	2.54 mm	Beryllium Nickel	Closed Frame	Through Hole	1 A	2.54 mm	0.1 in	UL94 V-0	Nickel Boron	Nickel Boron
Aries Electronics 42-3573-11	42	0.25 çm	10 çin	0.25 çm	10 çin	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	0.11 in	2.78 mm	Solder	7.62 mm	0.3 in	DIP ZIF (ZIP)	0.1 in	2.54 mm	Beryllium Copper	Closed Frame	Through Hole	1 A	2.54 mm	0.1 in	UL94 V-0	Gold	Gold
Aries Electronics 42-3573-10	42	5.08 µm	200 µin	5.08 µm	200 µin	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	0.11 in	2.78 mm	Solder	7.62 mm	0.3 in	DIP ZIF (ZIP)	0.1 in	2.54 mm	Beryllium Copper	Closed Frame	Through Hole	1 A	2.54 mm	0.1 in	UL94 V-0		Tin