48-3551 Series

Catalog

CONN IC DIP SOCKET ZIF 48POS

Part	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Type	Type	Type	Contact Material - Post	Current Rating (Amps)	Pitch - Post	Pitch - Post	Mounting Type	Number of Positions or Pins (Grid)	Termination Post Length	Termination Post Length	Material Flammability Rating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Pitch - Mating	Pitch - Mating	Contact Material - Mating	Features	Termination	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 48-3551-16	Nickel Boron	1.27 µm	50 µin	Nickel Boron	7.62 mm	0.3 in	DIP ZIF (ZIP)	Beryllium Copper	1 A	2.54 mm	0.1 in	Through Hole	48	0.11 in	2.78 mm	UL94 V-0	1.27 µm	50 µin	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	Beryllium Copper	Closed Frame	Solder
Aries Electronics 48-3551-10	Tin	5.08 µm	200 µin		7.62 mm	0.3 in	DIP ZIF (ZIP)	Beryllium Copper	1 A	2.54 mm	0.1 in	Through Hole	48	0.11 in	2.78 mm	UL94 V-0	5.08 µm	200 µin	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	Beryllium Copper	Closed Frame	Solder
Aries Electronics 48-3551-18	Nickel Boron	1.27 µm	50 µin	Nickel Boron	7.62 mm	0.3 in	DIP ZIF (ZIP)	Beryllium Nickel	1 A	2.54 mm	0.1 in	Through Hole	48	0.11 in	2.78 mm	UL94 V-0	1.27 µm	50 µin	Polyetheretherketone (PEEK) Glass Filled	0.1 in	2.54 mm	Beryllium Nickel	Closed Frame	Solder	-55 °C	250 °C
Aries Electronics 48-3551-11	Gold			Gold	7.62 mm	0.3 in	DIP ZIF (ZIP)	Beryllium Copper	1 A	2.54 mm	0.1 in	Through Hole	48	0.11 in	2.78 mm	UL94 V-0			Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	Beryllium Copper	Closed Frame	Solder