IC FLASH 256MBIT SPI/QUAD 16SOIC
| Part | Memory Organization | Technology | Clock Frequency | Mounting Type | Operating Temperature [Max] | Operating Temperature [Min] | Write Cycle Time - Word, Page [custom] | Write Cycle Time - Word, Page [custom] | Package / Case [x] | Package / Case | Package / Case [y] | Memory Format | Memory Interface | Voltage - Supply [Min] | Voltage - Supply [Max] | Memory Type | Supplier Device Package | Memory Size | Write Cycle Time - Word, Page |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 32 M | FLASH - NOR | 104 MHz | Surface Mount | 85 °C | -40 °C | 3 ms | 50 µs | 0.295 in | 16-SOIC | 7.5 mm | FLASH | QPI Quad I/O SPI | 2.7 V | 3.6 V | Non-Volatile | 16-SOIC | 256 Gbit | |
Winbond Electronics | 32 M | FLASH - NOR | 104 MHz | Surface Mount | 85 °C | -40 °C | 3 ms | 50 µs | 0.295 in | 16-SOIC | 7.5 mm | FLASH | QPI Quad I/O SPI | 2.7 V | 3.6 V | Non-Volatile | 16-SOIC | 256 Gbit | |
Winbond Electronics | 32 M | FLASH - NOR | 104 MHz | Surface Mount | 85 °C | -40 °C | 3 ms | 50 µs | 0.295 in | 16-SOIC | 7.5 mm | FLASH | QPI Quad I/O SPI | 2.7 V | 3.6 V | Non-Volatile | 16-SOIC | 256 Gbit | |
Winbond Electronics | 32 M | FLASH - NOR | 133 MHz | Surface Mount | 85 °C | -40 °C | 0.295 in | 16-SOIC | 7.5 mm | FLASH | SPI - Quad I/O | 2.7 V | 3.6 V | Non-Volatile | 16-SOIC | 256 Gbit | 3 ms | ||
Winbond Electronics | 32 M | FLASH - NOR | 133 MHz | Surface Mount | 85 °C | -40 °C | 0.295 in | 16-SOIC | 7.5 mm | FLASH | SPI - Quad I/O | 2.7 V | 3.6 V | Non-Volatile | 16-SOIC | 256 Gbit | 3 ms |