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CONN IC DIP SOCKET ZIF 42POS TIN
| Part | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Material Flammability Rating | Contact Material - Post | Current Rating (Amps) | Housing Material | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Type | Type | Type | Pitch - Mating | Pitch - Mating | Features | Termination | Number of Positions or Pins (Grid) | Mounting Type | Termination Post Length | Termination Post Length | Pitch - Post | Pitch - Post | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 200 µin | 5.08 µm | UL94 V-0 | Beryllium Copper | 1 A | Polyphenylene Sulfide (PPS) Glass Filled | Tin | 5.08 µm | 200 µin | Beryllium Copper | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | 0.1 in | 2.54 mm | Closed Frame | Solder | 42 | Through Hole | 0.11 in | 2.78 mm | 2.54 mm | 0.1 in | |||
Aries Electronics | 50 µin | 1.27 µm | UL94 V-0 | Beryllium Nickel | 1 A | Polyetheretherketone (PEEK) Glass Filled | Nickel Boron | 1.27 µm | 50 µin | Beryllium Nickel | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | 0.1 in | 2.54 mm | Closed Frame | Solder | 42 | Through Hole | 0.11 in | 2.78 mm | 2.54 mm | 0.1 in | -55 °C | 250 °C | Nickel Boron |