48-6553 Series

Catalog

CONN IC DIP SOCKET ZIF 48POS GLD

Part	Contact Finish - Post	Mounting Type	Contact Material - Mating	Termination	Material Flammability Rating	Housing Material	Termination Post Length	Termination Post Length	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Contact Material - Post	Pitch - Post	Pitch - Post	Current Rating (Amps)	Features	Number of Positions or Pins (Grid)	Type	Type	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 48-6553-11	Gold	Through Hole	Beryllium Copper	Solder	UL94 V-0	Polyphenylene Sulfide (PPS) Glass Filled	0.11 in	2.78 mm	0.1 in	2.54 mm	Gold	Beryllium Copper	2.54 mm	0.1 in	1 A	Closed Frame	48	15.24 mm	DIP ZIF (ZIP)	0.6 "
Aries Electronics 48-6553-10	Tin	Through Hole	Beryllium Copper	Solder	UL94 V-0	Polyphenylene Sulfide (PPS) Glass Filled	0.11 in	2.78 mm	0.1 in	2.54 mm		Beryllium Copper	2.54 mm	0.1 in	1 A	Closed Frame	48	15.24 mm	DIP ZIF (ZIP)	0.6 "	200 µin	5.08 µm	5.08 µm	200 µin
Aries Electronics 48-6553-18	Nickel Boron	Through Hole	Beryllium Nickel	Solder	UL94 V-0	Polyetheretherketone (PEEK) Glass Filled	0.11 in	2.78 mm	0.1 in	2.54 mm	Nickel Boron	Beryllium Nickel	2.54 mm	0.1 in	1 A	Closed Frame	48	15.24 mm	DIP ZIF (ZIP)	0.6 "	50 µin	1.27 µm	1.27 µm	50 µin	-55 °C	250 °C