IC FLASH 4MBIT SPI/DUAL 6USON
| Part | Memory Organization | Write Cycle Time - Word, Page [custom] | Write Cycle Time - Word, Page [custom] | Voltage - Supply [Max] | Voltage - Supply [Min] | Memory Interface | Memory Type | Access Time | Package / Case | Technology | Operating Temperature [Max] | Operating Temperature [Min] | Clock Frequency | Mounting Type | Supplier Device Package | Memory Size | Memory Format | Package / Case [y] | Package / Case [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GigaDevice Semiconductor (HK) Limited | 512 K | 6 ms | 100 µs | 2 V | 1.65 V | SPI - Dual I/O | Non-Volatile | 12 ns | 6-XFDFN | FLASH - NOR (SLC) | 85 °C | -40 °C | 50 MHz | Surface Mount | 6-USON (1.2x1.2) | 512 kb | FLASH | ||
GigaDevice Semiconductor (HK) Limited | 512 K | 6 ms | 97 µs | 2 V | 1.65 V | SPI - Dual I/O | Non-Volatile | 8-SOIC | FLASH - NOR | 85 °C | -40 °C | 50 MHz | Surface Mount | 8-SOP | 512 kb | FLASH | 3.9 mm | 0.154 in | |
GigaDevice Semiconductor (HK) Limited | 512 K | 6 ms | 97 µs | 2 V | 1.65 V | SPI - Dual I/O | Non-Volatile | 12 ns | 8-XFDFN Exposed Pad | FLASH - NOR (SLC) | 85 °C | -40 °C | 50 MHz | Surface Mount | 8-USON (1.5x1.5) | 512 kb | FLASH | ||
GigaDevice Semiconductor (HK) Limited | 512 K | 6 ms | 100 µs | 2 V | 1.65 V | SPI - Dual I/O | Non-Volatile | 12 ns | 8-XFDFN Exposed Pad | FLASH - NOR (SLC) | 85 °C | -40 °C | 50 MHz | Surface Mount | 8-USON (3x2) | 512 kb | FLASH | ||
GigaDevice Semiconductor (HK) Limited | 512 K | 6 ms | 100 µs | 2 V | 1.65 V | SPI - Dual I/O | Non-Volatile | 12 ns | 8-XFDFN Exposed Pad | FLASH - NOR (SLC) | 85 °C | -40 °C | 50 MHz | Surface Mount | 8-USON (1.5x1.5) | 512 kb | FLASH | ||
GigaDevice Semiconductor (HK) Limited | 512 K | 6 ms | 97 µs | 2 V | 1.65 V | SPI - Dual I/O | Non-Volatile | 8-XFDFN Exposed Pad | FLASH - NOR | 85 °C | -40 °C | 50 MHz | Surface Mount | 8-USON (2x3) | 512 kb | FLASH |