CONN PLUG 15POS SMD TIN
| Part | Pitch [x] | Pitch [x] | Mated Stacking Heights [z] | Height Above Board | Height Above Board | Contact Finish | Mounting Type | Features | Contact Finish Thickness | Contact Finish Thickness | Number of Rows | Number of Positions |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
Harwin Inc. | 0.039 in | 1 mm | 4.3 mm | 0.13 in | 3.3 mm | Tin | Surface Mount | Board Guide Solder Retention | 80 Áin | 2.03 Ám | 2 | 15 |
Harwin Inc. | 0.039 in | 1 mm | 4.3 mm | 0.13 in | 3.3 mm | Tin | Surface Mount | Board Guide Pick and Place Solder Retention | 80 Áin | 2.03 Ám | 2 | 51 |
Harwin Inc. | 0.039 in | 1 mm | 4.3 mm | 0.13 in | 3.3 mm | Tin | Surface Mount | Board Guide Pick and Place Solder Retention | 80 Áin | 2.03 Ám | 2 | 21 |
Harwin Inc. | 0.039 in | 1 mm | 4.3 mm | 0.13 in | 3.3 mm | Tin | Surface Mount | Board Guide Solder Retention | 80 Áin | 2.03 Ám | 2 | 51 |
Harwin Inc. | 0.039 in | 1 mm | 4.3 mm | 0.13 in | 3.3 mm | Tin | Surface Mount | Board Guide Solder Retention | 80 Áin | 2.03 Ám | 2 | 41 |
Harwin Inc. | 0.039 in | 1 mm | 4.3 mm | 0.13 in | 3.3 mm | Tin | Surface Mount | Board Guide Solder Retention | 80 Áin | 2.03 Ám | 2 | 41 |