CONN IC DIP SOCKET ZIF 48POS TIN
| Part | Current Rating (Amps) | Termination Post Length | Termination Post Length | Housing Material | Pitch - Post | Pitch - Post | Termination | Type | Type | Type | Mounting Type | Contact Material - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features | Material Flammability Rating | Contact Finish - Post | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Mating | Number of Positions or Pins (Grid) | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 1 A | 0.11 in | 2.78 mm | Polyphenylene Sulfide (PPS) Glass Filled | 2.54 mm | 0.1 in | Solder | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Through Hole | Beryllium Copper | 5.08 µm | 200 µin | Closed Frame | UL94 V-0 | Tin | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | Beryllium Copper | 48 | |
Aries Electronics | 1 A | 0.11 in | 2.78 mm | Polyphenylene Sulfide (PPS) Glass Filled | 2.54 mm | 0.1 in | Solder | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Through Hole | Beryllium Copper | 1.27 µm | 50 µin | Closed Frame | UL94 V-0 | Nickel Boron | 0.1 in | 2.54 mm | 50 µin | 1.27 µm | Beryllium Copper | 48 | Nickel Boron |