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CONN IC DIP SOCKET 40POS GOLD
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Mating | Contact Finish - Post | Termination | Contact Material - Mating | Current Rating (Amps) | Features | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Contact Material - Post [custom] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Mounting Type | Housing Material | Type | Type | Type | Termination Post Length | Termination Post Length | Operating Temperature [Max] | Operating Temperature [Min] | Pitch - Post | Pitch - Post | Material Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 30 Áin | 0.76 Ám | Gold | Gold | Solder | Beryllium Copper | 3 A | Closed Frame Elevated | 0.1 in | 2.54 mm | 40 | 20 | 2 | Brass | 10 çin | 0.25 çm | Through Hole | Glass Filled Nylon 4/6 Polyamide (PA46) | DIP | 0.6 in | 15.24 mm | 3.56 mm | 0.14 in | 105 ░C | -55 °C | 2.54 mm | 0.1 in | UL94 V-0 |