HEATSINK FORGED BLK ANO TOP MNT
| Part | Package Cooled | Thermal Resistance @ Forced Air Flow | Material Finish | Length [x] | Length [x] | Width | Width [y] | Shelf Life | Shape | Material | Attachment Method | Type | Thermal Resistance @ Natural | Fin Height | Fin Height | Fin Height [z] | Fin Height [z] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Tusonix a Subsidiary of CTS Electronic Components | ASIC BGA CPU LGA | 3.92 °C/W | Black Anodized | 22.61 mm | 0.89 in | 22.61 mm | 0.89 " | 24 Months | Fins Square | Aluminum Alloy | Thermal Tape Adhesive (Included) | Top Mount | 13.42 °C/W | ||||
Tusonix a Subsidiary of CTS Electronic Components | ASIC BGA CPU LGA | 2.82 °C/W | Black Anodized | 22.61 mm | 0.89 in | 22.61 mm | 0.89 " | 24 Months | Fins Square | Aluminum Alloy | Thermal Tape Adhesive (Included) | Top Mount | 10.82 °C/W | 1.283 " | 32.6 mm | ||
Tusonix a Subsidiary of CTS Electronic Components | ASIC BGA CPU LGA | 3.52 °C/W | Black Anodized | 22.61 mm | 0.89 in | 22.61 mm | 0.89 " | 24 Months | Fins Square | Aluminum Alloy | Thermal Tape Adhesive (Included) | Top Mount | 12.52 °C/W | 0.89 in | 22.61 mm | ||
Tusonix a Subsidiary of CTS Electronic Components | ASIC BGA CPU LGA | 4.62 °C/W 200 LFM | Black Anodized | 22.61 mm | 0.89 in | 22.61 mm | 0.89 " | 24 Months | Fins Square | Aluminum Alloy | Thermal Tape Adhesive (Included) | Top Mount | 14.12 °C/W | ||||
Tusonix a Subsidiary of CTS Electronic Components | ASIC BGA CPU LGA | 4.22 °C/W | Black Anodized | 22.61 mm | 0.89 in | 22.61 mm | 0.89 " | 24 Months | Fins Square | Aluminum Alloy | Thermal Tape Adhesive (Included) | Top Mount | 13.72 °C/W | 0.575 in | 14.6 mm |