CONN IC DIP SOCKET ZIF 44POS
| Part | Material Flammability Rating | Contact Material - Mating | Contact Finish - Mating | Type | Type | Type | Contact Material - Post | Number of Positions or Pins (Grid) | Housing Material | Termination | Pitch - Post | Pitch - Post | Mounting Type | Features | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination Post Length | Termination Post Length | Current Rating (Amps) | Operating Temperature [Min] | Operating Temperature [Max] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | UL94 V-0 | Beryllium Copper | Nickel Boron | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Beryllium Copper | 44 Positions or Pins | Polyphenylene Sulfide (PPS) Glass Filled | Solder | 2.54 mm | 0.1 in | Through Hole | Closed Frame | 0.1 in | 2.54 mm | 1.27 µm | 50 µin | Nickel Boron | 1.27 µm | 50 µin | 0.11 in | 2.78 mm | 1 A | ||
Aries Electronics | UL94 V-0 | Beryllium Nickel | Nickel Boron | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Beryllium Nickel | 44 Positions or Pins | Polyetheretherketone (PEEK) Glass Filled | Solder | 2.54 mm | 0.1 in | Through Hole | Closed Frame | 0.1 in | 2.54 mm | 1.27 µm | 50 µin | Nickel Boron | 1.27 µm | 50 µin | 0.11 in | 2.78 mm | 1 A | -55 °C | 250 °C |