IC FLASH 4MBIT SPI/DUAL 8USON
| Part | Supplier Device Package | Voltage - Supply [Min] | Voltage - Supply [Max] | Clock Frequency | Memory Organization | Memory Interface | Technology | Operating Temperature [Max] | Operating Temperature [Min] | Package / Case | Access Time | Mounting Type | Memory Type | Write Cycle Time - Word, Page [custom] | Write Cycle Time - Word, Page [custom] | Memory Format | Memory Size | Package / Case [y] | Package / Case [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GigaDevice Semiconductor (HK) Limited | 8-USON (1.5x1.5) | 1.65 V | 3.6 V | 104 MHz | 512 K | SPI - Dual I/O | FLASH - NOR (SLC) | 85 °C | -40 °C | 8-XFDFN Exposed Pad | 6 ns | Surface Mount | Non-Volatile | 6 ms | 100 µs | FLASH | 512 kb | ||
GigaDevice Semiconductor (HK) Limited | 8-SOP | 1.65 V | 3.6 V | 512 K | SPI - Quad I/O | FLASH - NOR | 85 °C | -40 °C | 8-SOIC | Surface Mount | Non-Volatile | FLASH | 512 kb | 3.9 mm | 0.154 in | ||||
GigaDevice Semiconductor (HK) Limited | 8-SOP | 1.65 V | 3.6 V | 104 MHz | 512 K | SPI - Dual I/O | FLASH - NOR (SLC) | 85 °C | -40 °C | 8-SOIC | 6 ns | Surface Mount | Non-Volatile | 6 ms | 100 µs | FLASH | 512 kb | 3.9 mm | 0.154 in |
GigaDevice Semiconductor (HK) Limited | 8-USON (2x3) | 1.65 V | 3.6 V | 512 K | SPI - Quad I/O | FLASH - NOR | 85 °C | -40 °C | 8-XFDFN Exposed Pad | Surface Mount | Non-Volatile | FLASH | 512 kb |