Beta
⌘K
BOARD LEVEL HEAT SINK
| Part | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material | Shape | Width [y] | Width [y] | Length [x] | Length [x] | Package Cooled | Attachment Method | Fin Height [z] | Fin Height [z] | Material Finish | Type | Thermal Resistance @ Forced Air Flow |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Boyd Laconia, LLC | 1 W | 17.9 °C/W | Aluminum | Rectangular Fins | 23.93 mm | 0.942 in | 0.98 in | 24.89 mm | TO-220 | Bolt On PC Pin | 12.7 mm | 0.5 in | Black Anodized | Board Level Vertical | 6 °C/W 400 LFM |