CONN IC DIP SOCKET 40POS TIN
| Part | Type | Type | Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post | Pitch - Mating | Pitch - Mating | Current Rating (Amps) | Pitch - Post | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Features | Material Flammability Rating | Contact Material - Mating | Housing Material | Termination Post Length | Termination Post Length | Contact Material - Post [custom] | Contact Finish - Mating | Operating Temperature [Max] | Operating Temperature [Min] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | DIP | 0.6 in | 15.24 mm | 200 µin | 5.08 µm | Phosphor Bronze | 0.1 in | 2.54 mm | 1.5 A | 2.54 mm | 0.1 in | Tin | 5.08 µm | 200 µin | Solder | 40 | 20 | 2 | Closed Frame | UL94 V-0 | Phosphor Bronze | Polyamide (PA46) Nylon 4/6 | 0.145 " | 3.68 mm | ||||
Aries Electronics | DIP | 0.6 in | 15.24 mm | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | 3 A | 2.54 mm | 0.1 in | Tin | 0.76 Ám | 30 Áin | Solder | 40 | 20 | 2 | Closed Frame | UL94 V-0 | Beryllium Copper | Glass Filled Nylon 4/6 Polyamide (PA46) | 0.14 in | 3.56 mm | Brass | Gold | 105 ░C | -55 °C |