42-6575 Series

Catalog

CONN IC DIP SOCKET ZIF 42POS TIN

Part	Mounting Type	Termination	Termination Post Length	Termination Post Length	Current Rating (Amps)	Contact Material - Mating	Material Flammability Rating	Type	Type	Type	Contact Material - Post	Housing Material	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Post	Pitch - Post	Features	Contact Finish - Post
Aries Electronics 42-6575-16	Through Hole	Solder	0.11 in	2.78 mm	1 A	Beryllium Copper	UL94 V-0	15.24 mm	DIP ZIF (ZIP)	0.6 "	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	5.08 µm	200 µin	42	200 µin	5.08 µm	2.54 mm	0.1 in	Closed Frame	Tin
Aries Electronics 42-6575-10	Through Hole	Solder	0.11 in	2.78 mm	1 A	Beryllium Copper	UL94 V-0	15.24 mm	DIP ZIF (ZIP)	0.6 "	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	5.08 µm	200 µin	42	200 µin	5.08 µm	2.54 mm	0.1 in	Closed Frame	Tin
Aries Electronics 42-6575-18	Through Hole	Solder	0.11 in	2.78 mm	1 A	Beryllium Copper	UL94 V-0	15.24 mm	DIP ZIF (ZIP)	0.6 "	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	5.08 µm	200 µin	42	200 µin	5.08 µm	2.54 mm	0.1 in	Closed Frame	Tin