10061913 Series

Catalog

CONN PCI EXP FMALE 164POS 0.039

Part	Mounting Type	Operating Temperature [Max]	Operating Temperature [Min]	Read Out	Number of Rows	Contact Finish Thickness	Contact Finish Thickness	Color	Material - Insulation	Contact Type	Contact Material	Contact Finish	Features	Number of Positions	Pitch [x]	Pitch [x]	Termination	Card Type	Gender	Card Thickness	Card Thickness	Contact Finish Thickness	Termination Rows	Number of Positions/Bay/Row [custom]	Number of Positions/Bay/Row [custom]
Amphenol ICC (FCI) 10061913-103TLF	Surface Mount	85 °C	-55 °C	Dual	2	0.76 Ám	30 Áin	Black	Glass Filled Nylon Polyamide (PA)	Cantilever	Copper Alloy	Gold	Board Guide Locking Ramp Solder Retention	164	0.039 in	1 mm	Solder	PCI Express™	Female	0.062 in	1.57 mm
Amphenol ICC (FCI) 10061913-110ALF	Surface Mount	85 °C	-55 °C	Dual	2	0.38 µm	15 µin	Black	Glass Filled Nylon Polyamide (PA)	Cantilever	Copper Alloy	Gold	Board Guide Locking Ramp Pick and Place Solder Retention	36	0.039 in	1 mm	Solder	PCI Express™	Female	0.062 in	1.57 mm
Amphenol ICC (FCI) 10061913-120MLF	Surface Mount	85 °C	-55 °C	Dual	2			Black	Glass Filled Nylon Polyamide (PA)	Cantilever	Copper Alloy	Gold	Board Guide Locking Ramp Pick and Place Solder Retention	36	0.039 in	1 mm	Solder	PCI Express™	Female	0.062 in	1.57 mm	Flash
Amphenol ICC (FCI) 10061913-112MLF	Surface Mount	85 °C	-55 °C	Dual	2	0.38 µm	15 µin	Black	Glass Filled Nylon Polyamide (PA)	Cantilever	Copper Alloy	Gold	Board Guide Locking Ramp Pick and Place Solder Retention	98	0.039 in	1 mm	Solder	PCI Express™	Female	0.062 in	1.57 mm		2
Amphenol ICC (FCI) 10061913-110RLF	Surface Mount	85 °C	-55 °C	Dual	2	0.38 µm	15 µin	Black	Glass Filled Nylon Polyamide (PA)	Cantilever	Copper Alloy	Gold	Board Guide Locking Ramp Pick and Place Solder Retention	36	0.039 in	1 mm	Solder	PCI Express™	Female	0.062 in	1.57 mm
Amphenol ICC (FCI) 10061913-103NLF	Surface Mount	85 °C	-55 °C	Dual	2	0.76 Ám	30 Áin	Black	Glass Filled Nylon Polyamide (PA)	Cantilever	Copper Alloy	Gold	Board Guide Locking Ramp Pick and Place Solder Retention	164	0.039 in	1 mm	Solder	PCI Express™	Female	0.062 in	1.57 mm
Amphenol ICC (FCI) 10061913-100ALF	Surface Mount	85 °C	-55 °C	Dual	2	0.76 Ám	30 Áin	Black	Glass Filled Nylon Polyamide (PA)	Cantilever	Copper Alloy	Gold	Board Guide Locking Ramp Pick and Place Solder Retention	36	0.039 in	1 mm	Solder	PCI Express™	Female	0.062 in	1.57 mm
Amphenol ICC (FCI) 10061913-123CLF	Surface Mount	85 °C	-55 °C	Dual	2			Black	Glass Filled Nylon Polyamide (PA)	Cantilever	Copper Alloy	Gold	Board Guide Locking Ramp Pick and Place Solder Retention	164	0.039 in	1 mm	Solder	PCI Express™	Female	0.062 in	1.57 mm	Flash		71	11
Amphenol ICC (FCI) 10061913-113PLF	Surface Mount	85 °C	-55 °C	Dual	2	0.38 µm	15 µin	Black	Glass Filled Nylon Polyamide (PA)	Cantilever	Copper Alloy	Gold	Board Guide Locking Ramp Solder Retention	164	0.039 in	1 mm	Solder	PCI Express™	Female	0.062 in	1.57 mm
Amphenol ICC (FCI) 10061913-111RLF	Surface Mount	85 °C	-55 °C	Dual	2	0.38 µm	15 µin	Black	Glass Filled Nylon Polyamide (PA)	Cantilever	Copper Alloy	Gold	Board Guide Locking Ramp Solder Retention	64	0.039 in	1 mm	Solder	PCI Express™	Female	0.062 in	1.57 mm