44-6551 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS GLD

Part	Contact Finish - Mating	Termination	Number of Positions or Pins (Grid)	Contact Material - Post	Pitch - Post	Pitch - Post	Current Rating (Amps)	Housing Material	Mounting Type	Termination Post Length	Termination Post Length	Contact Finish - Post	Type	Type	Type	Pitch - Mating	Pitch - Mating	Features	Contact Material - Mating	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 44-6551-11	Gold	Solder	44 Positions or Pins	Beryllium Copper	2.54 mm	0.1 in	1 A	Polyphenylene Sulfide (PPS) Glass Filled	Through Hole	0.11 in	2.78 mm	Gold	15.24 mm	DIP ZIF (ZIP)	0.6 "	0.1 in	2.54 mm	Closed Frame	Beryllium Copper	UL94 V-0
Aries Electronics 44-6551-10		Solder	44 Positions or Pins	Beryllium Copper	2.54 mm	0.1 in	1 A	Polyphenylene Sulfide (PPS) Glass Filled	Through Hole	0.11 in	2.78 mm	Tin	15.24 mm	DIP ZIF (ZIP)	0.6 "	0.1 in	2.54 mm	Closed Frame	Beryllium Copper	UL94 V-0	5.08 µm	200 µin	200 µin	5.08 µm
Aries Electronics 44-6551-18	Nickel Boron	Solder	44 Positions or Pins	Beryllium Nickel	2.54 mm	0.1 in	1 A	Polyetheretherketone (PEEK) Glass Filled	Through Hole	0.11 in	2.78 mm	Nickel Boron	15.24 mm	DIP ZIF (ZIP)	0.6 "	0.1 in	2.54 mm	Closed Frame	Beryllium Nickel	UL94 V-0	1.27 µm	50 µin	50 µin	1.27 µm	-55 °C	250 °C
Aries Electronics 44-6551-16	Nickel Boron	Solder	44 Positions or Pins	Beryllium Copper	2.54 mm	0.1 in	1 A	Polyphenylene Sulfide (PPS) Glass Filled	Through Hole	0.11 in	2.78 mm	Nickel Boron	15.24 mm	DIP ZIF (ZIP)	0.6 "	0.1 in	2.54 mm	Closed Frame	Beryllium Copper	UL94 V-0	1.27 µm	50 µin	50 µin	1.27 µm