38-1518 Series

Catalog

CONN IC DIP SOCKET 38POS GOLD

Part	Contact Finish - Post	Pitch - Post	Pitch - Post	Type	Type	Type	Current Rating (Amps)	Pitch - Mating	Pitch - Mating	Contact Material - Post [custom]	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Mounting Type	Features	Housing Material	Termination Post Length	Termination Post Length	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Mating	Termination	Number of Positions or Pins (Grid)	Material Flammability Rating
Aries Electronics 38-1518-10H	Tin	2.54 mm	0.1 in	DIP	5.08 mm	0.2 in	3 A	0.1 in	2.54 mm	Brass	Beryllium Copper	10 çin	0.25 çm	Through Hole	Open Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	3.18 mm	0.125 in	200 µin	5.08 µm	Gold	Solder	38	UL94 V-0
Aries Electronics 38-1518-00	Tin	2.54 mm	0.1 in	DIP	5.08 mm	0.2 in	3 A	0.1 in	2.54 mm	Brass	Beryllium Copper	10 çin	0.25 çm	Surface Mount	Open Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	3.18 mm	0.125 in	200 µin	5.08 µm	Gold	Solder	38	UL94 V-0
Aries Electronics 38-1518-11H	Gold	2.54 mm	0.1 in	DIP	5.08 mm	0.2 in	3 A	0.1 in	2.54 mm	Brass	Beryllium Copper	10 çin	0.25 çm	Through Hole	Open Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	3.18 mm	0.125 in	10 çin	0.25 çm	Gold	Solder	38	UL94 V-0
Aries Electronics 38-1518-11	Gold	2.54 mm	0.1 in	DIP	5.08 mm	0.2 in	3 A	0.1 in	2.54 mm	Brass	Beryllium Copper	10 çin	0.25 çm	Through Hole	Open Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	3.18 mm	0.125 in	10 çin	0.25 çm	Gold	Solder	38	UL94 V-0
Aries Electronics 38-1518-10T	Tin	2.54 mm	0.1 in	DIP	5.08 mm	0.2 in	3 A	0.1 in	2.54 mm	Brass	Beryllium Copper	10 çin	0.25 çm	Through Hole	Open Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	3.18 mm	0.125 in	200 µin	5.08 µm	Gold	Solder	38	UL94 V-0
Aries Electronics 38-1518-10	Tin	2.54 mm	0.1 in	DIP	5.08 mm	0.2 in	3 A	0.1 in	2.54 mm	Brass	Beryllium Copper	10 çin	0.25 çm	Through Hole	Open Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	3.18 mm	0.125 in	200 µin	5.08 µm	Gold	Solder	38	UL94 V-0