IC FLASH 1GBIT SPI 104MHZ 8WSON
| Part | Voltage - Supply [Min] | Voltage - Supply [Max] | Clock Frequency | Technology | Operating Temperature [Max] | Operating Temperature [Min] | Memory Organization | Memory Size | Mounting Type | Memory Type | Package / Case | Memory Interface | Memory Format | Supplier Device Package | Write Cycle Time - Word, Page | Access Time | Package / Case [x] | Package / Case [y] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 2.7 V | 3.6 V | 104 MHz | FLASH - NAND | 85 °C | -40 °C | 128 M | 1 Mbit | Surface Mount | Non-Volatile | 8-WDFN Exposed Pad | SPI | FLASH | 8-WSON (8x6) | ||||
Winbond Electronics | 2.7 V | 3.6 V | 104 MHz | FLASH - NAND | 85 °C | -40 °C | 128 M | 1 Mbit | Surface Mount | Non-Volatile | 8-WDFN Exposed Pad | SPI | FLASH | 8-WSON (8x6) | ||||
Winbond Electronics | 1.7 V | 1.95 V | 104 MHz | FLASH - NAND (SLC) | 85 °C | -40 °C | 128 M | 1 Mbit | Surface Mount | Non-Volatile | 24-TBGA | SPI - Quad I/O | FLASH | 24-TFBGA (8x6) | 700 µs | |||
Winbond Electronics | 1.7 V | 1.95 V | 104 MHz | FLASH - NAND (SLC) | 85 °C | -40 °C | 128 M | 1 Mbit | Surface Mount | Non-Volatile | 24-TBGA | SPI - Quad I/O | FLASH | 24-TFBGA (8x6) | 700 µs | 8 ns | ||
Winbond Electronics | 2.7 V | 3.6 V | 104 MHz | FLASH - NAND (SLC) | 85 °C | -40 °C | 128 M | 1 Mbit | Surface Mount | Non-Volatile | 16-SOIC | SPI - Quad I/O | FLASH | 16-SOIC | 700 µs | 0.295 in | 7.5 mm | |
Winbond Electronics | 1.7 V | 1.95 V | 166 MHz | FLASH - NAND (SLC) | 85 °C | -40 °C | 128 M | 1 Mbit | Surface Mount | Non-Volatile | 16-SOIC | DTR QPI Quad I/O SPI | FLASH | 16-SOIC | 700 µs | 6 ns | 0.295 in | 7.5 mm |