44-6556 Series

Catalog

CONN IC DIP SOCKET 44POS GOLD

Part	Mounting Type	Termination Post Length	Termination Post Length	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Type	Type	Contact Finish - Post	Contact Finish - Mating	Current Rating (Amps)	Number of Positions or Pins (Grid)	Material Flammability Rating	Features	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Contact Material - Post [custom]	Pitch - Post	Pitch - Post	Contact Material - Mating
Aries Electronics 44-6556-11	Through Hole	3.3 mm	0.13 in	Polyphenylene Sulfide (PPS) Glass Filled	10 çin	0.25 çm	DIP	0.6 in	15.24 mm	Gold	Gold	3 A	44 Positions or Pins	UL94 V-0	Open Frame	Solder	30 Áin	0.76 Ám	0.1 in	2.54 mm	Brass	2.54 mm	0.1 in	Beryllium Copper
Aries Electronics 44-6556-10	Through Hole	3.3 mm	0.13 in	Polyphenylene Sulfide (PPS) Glass Filled	200 µin	5.08 µm	DIP	0.6 in	15.24 mm	Tin	Gold	3 A	44 Positions or Pins	UL94 V-0	Open Frame	Solder	30 Áin	0.76 Ám	0.1 in	2.54 mm	Brass	2.54 mm	0.1 in	Beryllium Copper
Aries Electronics 44-6556-20	Through Hole	7.19 mm	0.283 in	Polyphenylene Sulfide (PPS) Glass Filled	200 µin	5.08 µm	DIP	0.6 in	15.24 mm	Tin	Gold	3 A	44 Positions or Pins	UL94 V-0	Open Frame	Wire Wrap	30 Áin	0.76 Ám	0.1 in	2.54 mm	Brass	2.54 mm	0.1 in	Beryllium Copper
Aries Electronics 44-6556-31	Through Hole	10.74 mm	0.423 in	Polyphenylene Sulfide (PPS) Glass Filled	10 çin	0.25 çm	DIP	0.6 in	15.24 mm	Gold	Gold	3 A	44 Positions or Pins	UL94 V-0	Open Frame	Wire Wrap	30 Áin	0.76 Ám	0.1 in	2.54 mm	Brass	2.54 mm	0.1 in	Beryllium Copper
Aries Electronics 44-6556-40	Through Hole	4.57 mm	0.18 in	Polyphenylene Sulfide (PPS) Glass Filled	200 µin	5.08 µm	DIP	0.6 in	15.24 mm	Tin	Gold	3 A	44 Positions or Pins	UL94 V-0	Open Frame		30 Áin	0.76 Ám	0.1 in	2.54 mm	Brass	2.54 mm	0.1 in	Beryllium Copper
Aries Electronics 44-6556-41	Through Hole	4.57 mm	0.18 in	Polyphenylene Sulfide (PPS) Glass Filled	10 çin	0.25 çm	DIP	0.6 in	15.24 mm	Gold	Gold	3 A	44 Positions or Pins	UL94 V-0	Open Frame		30 Áin	0.76 Ám	0.1 in	2.54 mm	Brass	2.54 mm	0.1 in	Beryllium Copper
Aries Electronics 44-6556-30	Through Hole	10.74 mm	0.423 in	Polyphenylene Sulfide (PPS) Glass Filled	200 µin	5.08 µm	DIP	0.6 in	15.24 mm	Tin	Gold	3 A	44 Positions or Pins	UL94 V-0	Open Frame	Wire Wrap	30 Áin	0.76 Ám	0.1 in	2.54 mm	Brass	2.54 mm	0.1 in	Beryllium Copper