XR2A Series

Manufacturer: Omron Electronics Inc-EMC Div

Catalog

CONN IC DIP SOCKET 20POS GOLD

Part	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid)	Contact Finish - Post	Contact Material - Post	Type	Type	Type	Termination Post Length	Termination Post Length	Contact Finish - Mating	Pitch - Mating	Pitch - Mating	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Current Rating (Amps)	Termination	Contact Resistance	Housing Material	Features	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Mounting Type	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Material - Post [custom]	Termination Post Length [x]	Termination Post Length [x]	Contact Finish Thickness - Post
Omron Electronics Inc-EMC Div XR2A-2001-N	2.54 mm	0.1 in	20	Gold	Beryllium Copper	0.3 "	7.62 mm	DIP	3.2 mm	0.126 in	Gold	0.1 in	2.54 mm	UL94 V-0	30 Áin	0.76 Ám	-55 °C	125 °C	1 A	Solder	20 mOhm	Polybutylene Terephthalate (PBT) Glass Filled	Open Frame	30 µin	0.76 µm	Beryllium Copper	Through Hole
Omron Electronics Inc-EMC Div XR2A-3211-N	2.54 mm	0.1 in		Gold	Beryllium Copper	0.6 in	15.24 mm	DIP	3.2 mm	0.126 in	Gold	0.1 in	2.54 mm	UL94 V-0	10 çin	0.25 çm	-55 °C	125 °C	1 A	Solder	20 mOhm	Polybutylene Terephthalate (PBT) Glass Filled	Open Frame	10 çin	0.25 çm	Beryllium Copper	Through Hole	2 x 16	32
Omron Electronics Inc-EMC Div XR2A-0815	2.54 mm	0.1 in	8	Gold		0.3 "	7.62 mm	DIP	2.23 mm	0.088 in	Gold	0.1 in	2.54 mm	UL94 V-0	10 çin	0.25 çm	-55 °C	125 °C	1 A	Solder	20 mOhm	Polybutylene Terephthalate (PBT) Glass Filled	Open Frame	10 çin	0.25 çm	Beryllium Copper	Through Hole			Brass
Omron Electronics Inc-EMC Div XR2A-1611-N	2.54 mm	0.1 in	16	Gold	Beryllium Copper	0.3 "	7.62 mm	DIP	3.2 mm	0.126 in	Gold	0.1 in	2.54 mm	UL94 V-0	10 çin	0.25 çm	-55 °C	125 °C	1 A	Solder	20 mOhm	Polybutylene Terephthalate (PBT) Glass Filled	Open Frame	10 çin	0.25 çm	Beryllium Copper	Through Hole
Omron Electronics Inc-EMC Div XR2A-2201-N	2.54 mm	0.1 in	22	Gold		0.4 in	10.16 mm	DIP			Gold	0.1 in	2.54 mm	UL94 V-0	29.5 Áin	0.75 Ám	-55 °C	125 °C	1 A	Solder	20 mOhm	Polybutylene Terephthalate (PBT) Glass Filled	Open Frame		0.75 µm	Beryllium Copper	Through Hole			Brass	0.138 in	3.5 mm	29.5 µin
Omron Electronics Inc-EMC Div XR2A-2801-N	2.54 mm	0.1 in	28	Gold	Beryllium Copper	0.6 in	15.24 mm	DIP	3.2 mm	0.126 in	Gold	0.1 in	2.54 mm	UL94 V-0	30 Áin	0.76 Ám	-55 °C	125 °C	1 A	Solder	20 mOhm	Polybutylene Terephthalate (PBT) Glass Filled	Open Frame	30 µin	0.76 µm	Beryllium Copper	Through Hole
Omron Electronics Inc-EMC Div XR2A-0811-N	2.54 mm	0.1 in	8	Gold	Beryllium Copper	0.3 "	7.62 mm	DIP	3.2 mm	0.126 in	Gold	0.1 in	2.54 mm	UL94 V-0	10 çin	0.25 çm	-55 °C	125 °C	1 A	Solder	20 mOhm	Polybutylene Terephthalate (PBT) Glass Filled	Open Frame	10 çin	0.25 çm	Beryllium Copper	Through Hole
Omron Electronics Inc-EMC Div XR2A-3201-N	2.54 mm	0.1 in		Gold	Beryllium Copper	0.6 in	15.24 mm	DIP	3.2 mm	0.126 in	Gold	0.1 in	2.54 mm	UL94 V-0	30 Áin	0.76 Ám	-55 °C	125 °C	1 A	Solder	20 mOhm	Polybutylene Terephthalate (PBT) Glass Filled	Open Frame	30 µin	0.76 µm	Beryllium Copper	Through Hole	2 x 16	32