44-3551 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS

Part	Termination Post Length	Termination Post Length	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Material Flammability Rating	Contact Finish - Mating	Contact Material - Mating	Mounting Type	Features	Type	Type	Type	Housing Material	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Post	Pitch - Post	Pitch - Post	Current Rating (Amps)	Number of Positions or Pins (Grid)	Contact Finish - Post	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 44-3551-16	0.11 in	2.78 mm	1.27 µm	50 µin	0.1 in	2.54 mm	UL94 V-0	Nickel Boron	Beryllium Copper	Through Hole	Closed Frame	7.62 mm	0.3 in	DIP ZIF (ZIP)	Polyphenylene Sulfide (PPS) Glass Filled	Solder	1.27 µm	50 µin	Beryllium Copper	2.54 mm	0.1 in	1 A	44 Positions or Pins	Nickel Boron
Aries Electronics 44-3551-18	0.11 in	2.78 mm	1.27 µm	50 µin	0.1 in	2.54 mm	UL94 V-0	Nickel Boron	Beryllium Nickel	Through Hole	Closed Frame	7.62 mm	0.3 in	DIP ZIF (ZIP)	Polyetheretherketone (PEEK) Glass Filled	Solder	1.27 µm	50 µin	Beryllium Nickel	2.54 mm	0.1 in	1 A	44 Positions or Pins	Nickel Boron	-55 °C	250 °C
Aries Electronics 44-3551-10	0.11 in	2.78 mm	5.08 µm	200 µin	0.1 in	2.54 mm	UL94 V-0		Beryllium Copper	Through Hole	Closed Frame	7.62 mm	0.3 in	DIP ZIF (ZIP)	Polyphenylene Sulfide (PPS) Glass Filled	Solder	5.08 µm	200 µin	Beryllium Copper	2.54 mm	0.1 in	1 A	44 Positions or Pins	Tin
Aries Electronics 44-3551-11	0.11 in	2.78 mm			0.1 in	2.54 mm	UL94 V-0	Gold	Beryllium Copper	Through Hole	Closed Frame	7.62 mm	0.3 in	DIP ZIF (ZIP)	Polyphenylene Sulfide (PPS) Glass Filled	Solder			Beryllium Copper	2.54 mm	0.1 in	1 A	44 Positions or Pins	Gold