42-3574 Series

Catalog

CONN IC DIP SOCKET ZIF 42POS TIN

Part	Housing Material	Contact Material - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Finish - Post	Current Rating (Amps)	Material Flammability Rating	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features	Termination Post Length	Termination Post Length	Termination	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Type	Type	Type	Mounting Type
Aries Electronics 42-3574-10	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	5.08 µm	200 µin	42	Tin	1 A	UL94 V-0	Beryllium Copper	200 µin	5.08 µm	Closed Frame	0.11 in	2.78 mm	Solder	0.1 in	2.54 mm	2.54 mm	0.1 in	7.62 mm	0.3 in	DIP ZIF (ZIP)	Through Hole
Aries Electronics 42-3574-16	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	5.08 µm	200 µin	42	Tin	1 A	UL94 V-0	Beryllium Copper	200 µin	5.08 µm	Closed Frame	0.11 in	2.78 mm	Solder	0.1 in	2.54 mm	2.54 mm	0.1 in	7.62 mm	0.3 in	DIP ZIF (ZIP)	Through Hole
Aries Electronics 42-3574-18	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	5.08 µm	200 µin	42	Tin	1 A	UL94 V-0	Beryllium Copper	200 µin	5.08 µm	Closed Frame	0.11 in	2.78 mm	Solder	0.1 in	2.54 mm	2.54 mm	0.1 in	7.62 mm	0.3 in	DIP ZIF (ZIP)	Through Hole
Aries Electronics 42-3574-11	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	5.08 µm	200 µin	42	Tin	1 A	UL94 V-0	Beryllium Copper	200 µin	5.08 µm	Closed Frame	0.11 in	2.78 mm	Solder	0.1 in	2.54 mm	2.54 mm	0.1 in	7.62 mm	0.3 in	DIP ZIF (ZIP)	Through Hole