CONN IC DIP SOCKET 40POS GOLD
| Part | Termination | Material Flammability Rating | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Type | Type | Type | Mounting Type | Termination Post Length | Termination Post Length | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Contact Material - Post [custom] | Features | Current Rating (Amps) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Finish - Mating | Housing Material | Contact Finish - Post | Pitch - Post | Pitch - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
3M (TC) | Solder | UL94 V-0 | 125 °C | -65 ░C | 0.203 Ám | 8 Áin | DIP | 0.6 in | 15.24 mm | Through Hole | 3.2 mm | 0.126 in | 0.1 in | 2.54 mm | 40 | 20 | 2 | Brass | Closed Frame Seal Tape | 1 A | Beryllium Copper | Flash | Gold | Polyphenylene Sulfide (PPS) Glass Filled | Gold | 2.54 mm | 0.1 in |
3M (TC) | Solder | UL94 V-0 | 125 °C | -65 ░C | 0.203 Ám | 8 Áin | DIP | 0.6 in | 15.24 mm | Through Hole | 3.2 mm | 0.126 in | 0.1 in | 2.54 mm | 40 | 20 | 2 | Brass | Open Frame | 1 A | Beryllium Copper | Flash | Gold | Polyphenylene Sulfide (PPS) Glass Filled | Gold | 2.54 mm | 0.1 in |