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CONN IC DIP SOCKET ZIF 44POS TIN
| Part | Housing Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Contact Material - Post | Contact Finish - Post | Features | Pitch - Post | Pitch - Post | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Material Flammability Rating | Mounting Type | Type | Type | Type | Number of Positions or Pins (Grid) | Contact Material - Mating | Termination Post Length | Termination Post Length | Current Rating (Amps) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Polyphenylene Sulfide (PPS) Glass Filled | 5.08 µm | 200 µin | Solder | Beryllium Copper | Tin | Closed Frame | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | UL94 V-0 | Through Hole | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | 44 Positions or Pins | Beryllium Copper | 0.11 in | 2.78 mm | 1 A |