CONN IC DIP SOCKET ZIF 36POS
| Part | Contact Finish - Mating | Termination Post Length | Termination Post Length | Mounting Type | Contact Material - Mating | Pitch - Post | Pitch - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features | Contact Material - Post | Housing Material | Current Rating (Amps) | Material Flammability Rating | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Post | Type | Type | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Nickel Boron | 0.11 in | 2.78 mm | Through Hole | Beryllium Nickel | 2.54 mm | 0.1 in | 1.27 µm | 50 µin | Solder | 0.1 in | 2.54 mm | 36 | 1.27 µm | 50 µin | Closed Frame | Beryllium Nickel | Polyetheretherketone (PEEK) Glass Filled | 1 A | UL94 V-0 | -55 °C | 250 °C | Nickel Boron | 7.62 mm | 0.3 in | DIP ZIF (ZIP) |