42-6574 Series

Catalog

CONN IC DIP SOCKET ZIF 42POS TIN

Part	Features	Contact Material - Mating	Material Flammability Rating	Termination	Current Rating (Amps)	Mounting Type	Pitch - Post	Pitch - Post	Pitch - Mating	Pitch - Mating	Type	Type	Type	Number of Positions or Pins (Grid)	Contact Material - Post	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Termination Post Length	Termination Post Length	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating
Aries Electronics 42-6574-16	Closed Frame	Beryllium Copper	UL94 V-0	Solder	1 A	Through Hole	2.54 mm	0.1 in	0.1 in	2.54 mm	15.24 mm	DIP ZIF (ZIP)	0.6 "	42	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	200 µin	5.08 µm	Tin	0.11 in	2.78 mm	5.08 µm	200 µin
Aries Electronics 42-6574-10	Closed Frame	Beryllium Copper	UL94 V-0	Solder	1 A	Through Hole	2.54 mm	0.1 in	0.1 in	2.54 mm	15.24 mm	DIP ZIF (ZIP)	0.6 "	42	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	200 µin	5.08 µm	Tin	0.11 in	2.78 mm	5.08 µm	200 µin
Aries Electronics 42-6574-18	Closed Frame	Beryllium Copper	UL94 V-0	Solder	1 A	Through Hole	2.54 mm	0.1 in	0.1 in	2.54 mm	15.24 mm	DIP ZIF (ZIP)	0.6 "	42	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	200 µin	5.08 µm	Tin	0.11 in	2.78 mm	5.08 µm	200 µin
Aries Electronics 42-6574-11	Closed Frame	Beryllium Copper	UL94 V-0	Solder	1 A	Through Hole	2.54 mm	0.1 in	0.1 in	2.54 mm	15.24 mm	DIP ZIF (ZIP)	0.6 "	42	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	200 µin	5.08 µm	Tin	0.11 in	2.78 mm	5.08 µm	200 µin