IC MCU 32BIT 2.5MB FLASH 144LQFP
| Part | Program Memory Size | Core Size [custom] | Oscillator Type | Data Converters [custom] | Data Converters [custom] | Package / Case | Peripherals | Program Memory Type | Mounting Type | Operating Temperature [Min] | Operating Temperature [Max] | Number of I/O | Supplier Device Package | Core Processor | RAM Size | Connectivity | Speed | Voltage - Supply (Vcc/Vdd) [Max] | Voltage - Supply (Vcc/Vdd) [Min] | EEPROM Size | Core Size | Data Converters |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Freescale Semiconductor - NXP | 2.5 MB | 32-Bit Dual-Core | Internal | 64 | 12 b | 144-LQFP | DMA LVD POR WDT | FLASH | Surface Mount | -40 °C | 125 °C | 79 | 144-LQFP (20x20) | e200z4 | 384 K | CANbus Ethernet FlexRay LINbus SPI UART/USART | 200 MHz | 5.5 V | 3.15 V | |||
Freescale Semiconductor - NXP | 1.5 MB | Internal | 100-LFBGA | DMA I2S POR WDT | FLASH | Surface Mount | -40 °C | 105 °C | 65 | 100-MAPBGA (11x11) | e200z4 | 192 K | CANbus Ethernet FlexRay I2C LINbus SPI | 160 MHz | 5.5 V | 3.15 V | 64 K | 32-Bit Single-Core | 16x12b 36x10b | |||
Freescale Semiconductor - NXP | 2.5 MB | 32-Bit Dual-Core | Internal | 64 | 12 b | 144-LQFP | DMA LVD POR WDT | FLASH | Surface Mount | -40 °C | 125 °C | 79 | 144-LQFP (20x20) | e200z4 | 384 K | CANbus Ethernet FlexRay LINbus SPI UART/USART | 200 MHz | 5.5 V | 3.15 V | |||
Freescale Semiconductor - NXP | 2.5 MB | 32-Bit Dual-Core | Internal | 64 | 12 b | 144-LQFP | DMA LVD POR WDT | FLASH | Surface Mount | -40 °C | 125 °C | 79 | 144-LQFP (20x20) | e200z4 | 384 K | CANbus Ethernet FlexRay LINbus SPI UART/USART | 180 MHz | 5.5 V | 3.15 V | |||
Freescale Semiconductor - NXP | 1.5 MB | Internal | 100-LFBGA | DMA I2S POR WDT | FLASH | Surface Mount | -40 °C | 125 °C | 100-MAPBGA (11x11) | e200z4 | 192 K | CANbus Ethernet FlexRay I2C LINbus SPI | 120 MHz | 5.5 V | 3.15 V | 64 K | 32-Bit Single-Core | 16x12b 36x10b | ||||
Freescale Semiconductor - NXP | 1.5 MB | 32-Bit Dual-Core | Internal | 100-LFBGA | DMA I2S POR WDT | FLASH | Surface Mount | -40 °C | 85 °C | 65 | 100-MAPBGA (11x11) | e200z2 e200z4 | 192 K | CANbus Ethernet FlexRay I2C LINbus SPI | 80 MHz 160 MHz | 5.5 V | 3.15 V | 64 K | 16x12b 36x10b | |||
Freescale Semiconductor - NXP | 1.5 MB | Internal | 176-LQFP Exposed Pad | DMA I2S POR WDT | FLASH | Surface Mount | -40 °C | 105 °C | 129 I/O | 176-LQFP (24x24) | e200z4 | 192 K | CANbus Ethernet FlexRay I2C LINbus SPI | 120 MHz | 5.5 V | 3.15 V | 64 K | 32-Bit Single-Core | 16x12b 36x10b | |||
Freescale Semiconductor - NXP | 1.5 MB | Internal | 176-LQFP Exposed Pad | DMA I2S POR WDT | FLASH | Surface Mount | -40 °C | 105 °C | 129 I/O | 176-LQFP (24x24) | e200z4 | 192 K | CANbus Ethernet FlexRay I2C LINbus SPI | 120 MHz | 5.5 V | 3.15 V | 64 K | 32-Bit Single-Core | 16x12b 36x10b | |||
Freescale Semiconductor - NXP | 1.5 MB | Internal | 176-LQFP Exposed Pad | DMA I2S POR WDT | FLASH | Surface Mount | -40 °C | 85 °C | 129 I/O | 176-LQFP (24x24) | e200z4 | 192 K | CANbus Ethernet FlexRay I2C LINbus SPI | 120 MHz | 5.5 V | 3.15 V | 64 K | 32-Bit Single-Core | 16x12b 36x10b | |||
Freescale Semiconductor - NXP | 1.5 MB | 32-Bit Dual-Core | Internal | 176-LQFP Exposed Pad | DMA I2S POR WDT | FLASH | Surface Mount | -40 °C | 85 °C | 129 I/O | 176-LQFP (24x24) | e200z2 e200z4 | 192 K | CANbus Ethernet FlexRay I2C LINbus SPI | 80 MHz 160 MHz | 5.5 V | 3.15 V | 64 K | 16x12b 36x10b |