32-6513 Series

Catalog

CONN IC DIP SOCKET 32POS GOLD

Part	Contact Material - Post [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Max]	Operating Temperature [Min]	Termination	Housing Material	Type	Type	Type	Current Rating (Amps)	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Contact Finish - Post	Material Flammability Rating	Mounting Type	Termination Post Length	Termination Post Length	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Pitch - Post	Pitch - Post	Features
Aries Electronics 32-6513-11	Brass	10 çin	0.25 çm	10 çin	0.25 çm	105 ░C	-55 °C	Solder	Glass Filled Nylon 4/6 Polyamide (PA46)	DIP	0.6 in	15.24 mm	3 A	Beryllium Copper	0.1 in	2.54 mm	Gold	Gold	UL94 V-0	Through Hole	3.18 mm	0.125 in	2 x 16	32	2.54 mm	0.1 in	Closed Frame
Aries Electronics 32-6513-10H	Brass	10 çin	0.25 çm	200 µin	5.08 µm	105 ░C	-55 °C	Solder	Glass Filled Nylon 4/6 Polyamide (PA46)	DIP	0.6 in	15.24 mm	3 A	Beryllium Copper	0.1 in	2.54 mm	Gold	Tin	UL94 V-0	Through Hole	3.18 mm	0.125 in	2 x 16	32	2.54 mm	0.1 in	Closed Frame
Aries Electronics 32-6513-10	Brass	10 çin	0.25 çm	200 µin	5.08 µm	105 ░C	-55 °C	Solder	Glass Filled Nylon 4/6 Polyamide (PA46)	DIP	0.6 in	15.24 mm	3 A	Beryllium Copper	0.1 in	2.54 mm	Gold	Tin	UL94 V-0	Through Hole	3.18 mm	0.125 in	2 x 16	32	2.54 mm	0.1 in	Closed Frame
Aries Electronics 32-6513-11H	Brass	10 çin	0.25 çm	10 çin	0.25 çm	105 ░C	-55 °C	Solder	Glass Filled Nylon 4/6 Polyamide (PA46)	DIP	0.6 in	15.24 mm	3 A	Beryllium Copper	0.1 in	2.54 mm	Gold	Gold	UL94 V-0	Through Hole	3.18 mm	0.125 in	2 x 16	32	2.54 mm	0.1 in	Closed Frame
Aries Electronics 32-6513-10T	Brass	10 çin	0.25 çm	200 µin	5.08 µm	105 ░C	-55 °C	Solder	Glass Filled Nylon 4/6 Polyamide (PA46)	DIP	0.6 in	15.24 mm	3 A	Beryllium Copper	0.1 in	2.54 mm	Gold	Tin	UL94 V-0	Through Hole	3.18 mm	0.125 in	2 x 16	32	2.54 mm	0.1 in	Closed Frame