CONN HEADER SMD 33POS 1MM
| Part | Mounting Type | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Insulation Color | Current Rating (Amps) | Number of Rows | Fastening Type | Material Flammability Rating | Connector Type | Insulation Height [z] | Insulation Height [z] | Termination | Shrouding | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Post | Number of Positions Loaded | Contact Length - Mating | Contact Length - Mating | Contact Material | Number of Positions | Contact Shape | Mated Stacking Heights | Insulation Material | Contact Type | Contact Finish - Mating | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features | Mated Stacking Heights [z] | Insulation Height | Insulation Height |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Surface Mount | 2.54 mm | 0.1 in | Black | 2.8 A per Contact | 2 | Push-Pull | UL94 V-0 | Header | 0.098 in | 2.5 mm | Solder | Unshrouded | -55 °C | 125 °C | Tin | All | 0.065 in | 1.65 mm | Phosphor Bronze | 33 | Square | 5 mm | Liquid Crystal Polymer (LCP) | Male Pin | Gold | 0.039 in | 1 mm | 10 çin | 0.25 çm | Board Guide | |||
Samtec Inc. | Surface Mount | 2.54 mm | 0.1 in | Black | 2.8 A per Contact | 2 | Push-Pull | UL94 V-0 | Header | Solder | Unshrouded | -55 °C | 125 °C | Tin | All | 0.065 in | 1.65 mm | Phosphor Bronze | 33 | Square | Liquid Crystal Polymer (LCP) | Male Pin | Gold | 0.039 in | 1 mm | 10 çin | 0.25 çm | 4.14 mm | 1.63 mm | 0.064 in | ||||
Samtec Inc. | Surface Mount | 2.54 mm | 0.1 in | Black | 2.8 A per Contact | 2 | Push-Pull | UL94 V-0 | Header | 0.168 in | 4.27 mm | Solder | Shrouded - 4 Wall | -55 °C | 125 °C | Tin | All | 0.065 in | 1.65 mm | Phosphor Bronze | 33 | Square | Liquid Crystal Polymer (LCP) | Male Pin | Gold | 0.039 in | 1 mm | 3 µin | 0.076 µm | End Shrouds | ||||
Samtec Inc. | Surface Mount | 2.54 mm | 0.1 in | Black | 2.8 A per Contact | 2 | Push-Pull | UL94 V-0 | Header | 0.098 in | 2.5 mm | Solder | Unshrouded | -55 °C | 125 °C | Tin | All | 0.065 in | 1.65 mm | Phosphor Bronze | 33 | Square | 5 mm | Liquid Crystal Polymer (LCP) | Male Pin | Gold | 0.039 in | 1 mm | 3 µin | 0.076 µm | Board Guide | |||
Samtec Inc. | Surface Mount | 2.54 mm | 0.1 in | Black | 2.8 A per Contact | 2 | Push-Pull | UL94 V-0 | Header | Solder | Unshrouded | -55 °C | 125 °C | Tin | All | 0.065 in | 1.65 mm | Phosphor Bronze | 33 | Square | Liquid Crystal Polymer (LCP) | Male Pin | Gold | 0.039 in | 1 mm | 10 çin | 0.25 çm | 1.63 mm | 0.064 in | |||||
Samtec Inc. | Surface Mount | 2.54 mm | 0.1 in | Black | 2.8 A per Contact | 2 | Push-Pull | UL94 V-0 | Header | 0.098 in | 2.5 mm | Solder | Unshrouded | -55 °C | 125 °C | Tin | All | 0.065 in | 1.65 mm | Phosphor Bronze | 33 | Square | 5 mm | Liquid Crystal Polymer (LCP) | Male Pin | Gold | 0.039 in | 1 mm | 10 çin | 0.25 çm | Board Guide | |||
Samtec Inc. | Surface Mount | 2.54 mm | 0.1 in | Black | 2.8 A per Contact | 2 | Push-Pull | UL94 V-0 | Header | Solder | Shrouded - 4 Wall | -55 °C | 125 °C | Tin | All | 0.065 in | 1.65 mm | Phosphor Bronze | 33 | Square | Liquid Crystal Polymer (LCP) | Male Pin | Gold | 0.039 in | 1 mm | 10 çin | 0.25 çm | End Shrouds | 4.14 mm | 3.9 mm | 0.154 in | |||
Samtec Inc. | Surface Mount | 2.54 mm | 0.1 in | Black | 2.8 A per Contact | 2 | Push-Pull | UL94 V-0 | Header | 0.098 in | 2.5 mm | Solder | Unshrouded | -55 °C | 125 °C | Tin | All | 0.065 in | 1.65 mm | Phosphor Bronze | 33 | Square | 5 mm | Liquid Crystal Polymer (LCP) | Male Pin | Gold | 0.039 in | 1 mm | 10 çin | 0.25 çm | Board Guide |