IC DRAM 256MBIT LVTTL 54TFBGA
| Part | Memory Type | Memory Organization | Voltage - Supply [Max] | Voltage - Supply [Min] | Technology | Supplier Device Package | Access Time | Mounting Type | Memory Size | Package / Case | Clock Frequency | Memory Interface | Memory Format | Operating Temperature [Max] | Operating Temperature [Min] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | Volatile | 16 M | 3.6 V | 3 V | SDRAM | 54-TFBGA (8x8) | 5 ns | Surface Mount | 256 Gbit | 54-TFBGA | 166 MHz | LVTTL | DRAM | ||
Winbond Electronics | Volatile | 16 M | 3.6 V | 3 V | SDRAM | 54-TFBGA (8x8) | 5 ns | Surface Mount | 256 Gbit | 54-TFBGA | 166 MHz | Parallel | DRAM | 70 °C | 0 °C |
Winbond Electronics | Volatile | 16 M | 3.6 V | 3 V | SDRAM | 54-TSOP II | 5 ns | Surface Mount | 256 Gbit | 166 MHz | Parallel | DRAM | 70 °C | 0 °C | |
Winbond Electronics | Volatile | 16 M | 3.6 V | 3 V | SDRAM | 54-TSOP II | 5 ns | Surface Mount | 256 Gbit | 166 MHz | Parallel | DRAM | 70 °C | 0 °C | |
Winbond Electronics | Volatile | 16 M | 3.6 V | 3 V | SDRAM | 54-TSOP II | 5 ns | Surface Mount | 256 Gbit | 166 MHz | Parallel | DRAM | 85 °C | -40 °C | |
Winbond Electronics | Volatile | 16 M | 3.6 V | 3 V | SDRAM | 54-TSOP II | 5 ns | Surface Mount | 256 Gbit | 166 MHz | Parallel | DRAM | 85 °C | -40 °C | |
Winbond Electronics | Volatile | 16 M | 3.6 V | 3 V | SDRAM | 54-TSOP II | 5 ns | Surface Mount | 256 Gbit | 200 MHz | Parallel | DRAM | 70 °C | 0 °C | |
Winbond Electronics | Volatile | 16 M | 3.6 V | 3 V | SDRAM | 54-TSOP II | 5 ns | Surface Mount | 256 Gbit | 166 MHz | Parallel | DRAM | 85 °C | -40 °C | |
Winbond Electronics | Volatile | 16 M | 3.6 V | 3 V | SDRAM | 54-TSOP II | 5 ns | Surface Mount | 256 Gbit | 166 MHz | Parallel | DRAM | 70 °C | 0 °C | |
Winbond Electronics | Volatile | 16 M | 3.6 V | 3 V | SDRAM | 54-TSOP II | 5 ns | Surface Mount | 256 Gbit | 166 MHz | Parallel | DRAM | 70 °C | 0 °C |