Beta
⌘K
CONN SOCKET PGA ZIF GOLD
| Part | Current Rating (Amps) | Pitch - Post | Pitch - Post | Pitch - Mating | Pitch - Mating | Contact Material - Post | Contact Finish - Post | Mounting Type | Termination | Contact Finish - Mating | Type | Contact Material - Mating | Operating Temperature [Max] | Operating Temperature [Min] | Termination Post Length | Termination Post Length | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 1 A | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | Beryllium Copper | Tin | Through Hole | Solder | Gold | PGA ZIF (ZIP) | Beryllium Copper | 125 °C | -65 ░C | 3.18 mm | 0.125 in | Closed Frame | 30 Áin | 0.76 Ám | UL94 V-0 | 200 µin | 5.08 µm |